Samsung Electronics Co. will set up an advanced chip packaging research and development center in Yokohama, Japan with an investment of 25 billion yen ($170 million), according to semiconductor ...

Cirrus Logic (Nasdaq: CRUS), a leading provider of high-performance audio and mixed-signal semiconductor solutions, today announced the expansion of its long-standing relationship with GlobalFoundries ...

The CST highlights the UK will require approximately 16,800 over the next five years, an increase of 4,800 new designers. Replacing retiring designers, where 39% are expected to retire in the next 15 ...

Aston University recently launched ECSTATIC, a €5.1 million ($5.9 million) European research project that repurposes fiber-optic telecom cables as real-time structural sensors.

CFrame60, the independent HW IP, for DRAM bandwidth reduction to improve performance and power efficiency, is now in Chips&Media’s roadmap for the commercialization. This decision is to expand the ...

Integration of Omniverse into Ansys applications offers a seamless solution for embedding, distributing, and supporting Omniverse technologies through global network of thousands of direct sellers and ...

Port-Based Routing is a route-based on the Port ID. A PBR switch requires an assigned PID to send and receive management ...

TOKYO, Japan and SANTA CLARA, California — August 18, 2025 — SoftBank Group Corp. (TOKYO: 9984, “SoftBank”) and Intel Corporation (Nasdaq: INTC) today announced their signing of a definitive ...

Metal ECO is a process carried out by changing the Metal connection (Metal layers) only. This is a very common approach in ...

"Earning Gold for Most Innovative Tech Company of the Year, alongside Silver and Bronze for our FlexGen NoC IP and Magillem Registers software, reflects the dedication of our team and the meaningful ...

T2M-IP, a global provider of semiconductor IP cores, recently announced licensing its Silicon Proven MIPI C/D-PHY Combo IP core and MIPI DSI Controller IP core to a prominent U.S. automotive ...

Following this decision, TSMC has already notified customers that its Fab 2, which produces 6-inch wafers, will cease production in 2027. The company will later provide final wafer schedules and plans ...